New Delhi, Aug 12 (PTI) The Union Cabinet has approved four new semiconductor projects under India Semiconductor Mission incentive scheme entailing an investment of Rs 4,600 crore including an unit backed by US technology companies Intel, Lockheed Martin and Applied Material, electronics and IT minister Ashwini Vaishnaw said on Tuesday.
The four proposals approved today are from SiCSem, Continental Device India Private Limited (CDIL), 3D Glass Solutions Inc., and Advanced System in Package (ASIP) Technologies.
SiCSem and 3D Glass Solutions will be set up in BJP-ruled state Odisha, Advanced System in Package (ASIP) Technologies will be set up in BJP ally TDP ruled state Andhra Pradesh and CDIL’s semiconductor plant will come up in Mohali, Punjab.
“All these projects will become operational in 2-3 years,” Vaishnaw said.
With these four more approvals today, total approved projects under ISM reached 10 with cumulative investments of around Rs.1.60 lakh crore in 6 states.
SicSem Private Limited is collaborating with Clas-SiC Wafer Fab Ltd., UK, to establish an integrated facility of Silicon Carbide (SiC) based Compound Semiconductors in Info Valley, Bhubaneshwar, Odisha.
This will be 1st commercial compound fab in the country.
The SicSem project proposes to manufacture Silicon Carbide devices with an annual capacity of 60,000 wafers and packaging capacity of 96 million units.
The proposed products will have applications in Missiles, Defence equipment, Electric Vehicles (EVs), Railway, Fast Chargers, Data Centre racks, Consumer Appliances, and Solar Power Inverters.
3D Glass Solutions Inc. (3DGS) will be setting up a vertically integrated advanced packaging and embedded glass substrate unit in Info Valley, Bhubaneshwar, Odisha. This unit will bring world’s most advanced packaging technology to India. Advanced packaging brings the next generation of efficiency to the semiconductor industry.
The facility will have a large variety of advanced technologies including glass interposers with passives and silicon bridges, and 3D Heterogeneous Integration (3DHI) modules. Planned capacity of this unit will be approximately 69,600 glass panel substrates, 50 million assembled units, and 13,200 3DHI modules per annum.
The proposed products from 3G Glass unit will have significant applications in defence, high-performance computing, artificial intelligence, RF and automotive, photonics and co-packaged optics etc.
Advanced System in Package Technologies (ASIP) will setup a semiconductor manufacturing unit in Andhra Pradesh, under technology tie-up with APACT Co. Ltd, South Korea, with an annual capacity of 96 Million units. The manufactured products will find applications in mobile phones, set-top boxes, automobile applications, and other electronic products.
Continental Device (CDIL) will expand its discrete semiconductor manufacturing facility at Mohali, Punjab. The proposed facility will manufacture high-power discrete semiconductor devices such as MOSFETs, IGBTs, Schottky Bypass Diodes, and transistors, both in Silicon and Silicon Carbide.
The annual capacity of this brownfield expansion will be to the tune of 158.38 million units. The devices manufactured by these proposed units will have applications in Automotive electronics including EVs and its charging infrastructure, Renewable energy systems, Power conversion applications, industrial applications and communication infrastructure. Tags: Semiconductor, CDIL, 3D Glass, ASIP. Ashwini Vaishnaw, minister, cabinet, electronics
